surface mount technology

Since 2008, EM Solutions Inc has used state-of-the-art technology to provide high-quality PCBA boards to customers in many different fields of technology. Our facilities utilize the latest engineering tools and practices to assure confidence in design, testing, and production. Our experienced team handles everything from basic passive components to through-hole parts to fine pitch BGAs.

  • SMT and Thru-Hole Assembly
  • 0201/1005 Passive Components
  • Double-Sided Assembly
  • 0.3/0.4 Fine Pitch ICs
  • Low Volume, High-Mix Orders
  • Ball Grid Arrays (BGAs) up to 29×29
  • Mid-Sized Production Runs
  • BGA Repair and Reball
  • General Engineering Rework
  • Box Builds